High-Quality Reworkable Epoxy Underfill

The Loctite 2063673 Reworkable Epoxy Underfill is a high-quality solution for CSP and BGA applications. This low viscosity material is designed to flow easily at room temperature, eliminating the need for preheating. The result is a reliable and efficient bonding process.

Key Benefits

This Loctite reworkable epoxy underfill offers several key benefits. Its low viscosity ensures easy application, while its halogen-free composition makes it an environmentally friendly choice. The material cures quickly at moderate temperatures, minimizing stress to other components.

Reliable and Durable

When cured, the Loctite 2063673 Reworkable Epoxy Underfill reaches a high glass transition temperature, ensuring durability and reliability in a variety of applications. The material also maintains flexibility, protecting solder joints during thermal cycling and drop testing.

Optimal for CSP and BGA Applications

The Loctite ECCOBOND UF 3811 reworkable epoxy underfill is specifically designed for chip scale packaging (CSP) and ball grid array (BGA) applications. Its unique properties make it an ideal choice for these demanding uses.

Buy with Confidence

When you buy the Loctite 2063673 Reworkable Epoxy Underfill, you can trust that you're getting a high-quality product from a trusted brand. With its reliable performance and durability, this underfill is the perfect choice for your electronics needs.